Larimer County wraps up 2013 Chip Seal Program next week

During the week of Aug. 19, Larimer County Road and Bridge Department’s 2013 Chip Seal Program is scheduled to take place in areas north and east of Fort Collins City limits. Next week’s work concludes this year’s Chip Seal Program.

Informational signs will be posted on affected roads detailing exact locations and time frames. Please call our chip seal project line at 498-5666 or visit our web page www.larimer.org for more information or updated schedules.

The Chip Seal Program consists of pothole patching, crack-filling, pre-sweeping, chip seal, post-sweeping, fog sealing and re-striping as necessary. The chip seal will receive a fog seal at night between 10 p.m. and 6 a.m. after the post chip seal sweeping has been completed. Traffic will be limited to one lane in these areas, expect delays of 10-15 minutes. Motorists, bike riders and pedestrians may wish to choose alternate routes until the post chip seal sweeping is completed, usually no later than 72 hours after chip application. We encourage all traffic to drive slowly through the work zones and obey the posted speed limit to prevent materials that are being applied to the road from getting on vehicles or breaking windshields.

Please note that this schedule may change due to unforeseen circumstances.

During the week of Aug. 19, we will be working in the following areas:

Nedrah Acres Subdivision — all remaining streets — Mon. 8/19

Richards Lake Road from Turnberry Rd. west to cul-de-sac — Mon. 8/19

Gregory Road from Fort Collins City limits north to State Hwy. 1 — Mon. 8/19

Country Club Road from State Hwy. 1 east to Turnberry Rd. — Tue. 8/20

Larimer County Road 5 from CR 48 (Vine St.) north to end of asphalt (1/2 mile) — Wed. 8/21

Larimer County Road 48 (Vine Dr.) from I-25 Frontage Rd. west approx 2/3 mile — Wed. 8/21

Larimer County Road 1 (County Line Rd.) from CR 48 (Vine St.) North approx ½ mile — Wed. 8/21

Be the first to comment

Leave a Reply

Your email address will not be published.


*